Behind-the-ear processor cochlear implant Osia®

The Osia System features an implant that sits entirely under the skin. The active implant includes the Piezo Power™ transducer, which generates vibrations based on sound signal. The Osia OSI200 Implant As a part of the Osia System, the OSI200 Implant allows sound to bypass blocked parts of the natural hearing pathway. The implant is placed under the skin where it's attached to a bone conduction (BI300) implant to send sound vibrations directly to the inner ear. Piezo Power™ technology The Osia System uses a special Piezo Power™ transducer that expands and contracts to create vibrations. The Piezo Power tranducer is able to vibrate at both low and high frequencies. The Osia indications For people with bone conduction hearing loss up to 55 dB. Conductive hearing loss Mix hearing loss SSD