Silicone medical assembly adhesive MasterSil 151Med
for medical devicesmedical industrylow-viscosity

Silicone medical assembly adhesive - MasterSil 151Med - Master Bond - for medical devices / medical industry / low-viscosity
Silicone medical assembly adhesive - MasterSil 151Med - Master Bond - for medical devices / medical industry / low-viscosity
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Characteristics

Chemical composition
silicone
Applications
for medical devices, medical industry
Other characteristics
low-viscosity

Description

Meets USP Class VI specifications Passes ISO 10993-5 for cytotoxicity High flexibility Optically clear Electrically insulative Low viscosity Master Bond MasterSil 151Med is a two component, low viscosity silicone compound for high performance potting and encapsulation. MasterSil 151Med is an addition cured system and does not require exposure to air for complete cross-linking. It has a convenient ten to one mix ratio by weight, and will not outgas while curing. It is 100% solids and contains no solvents. MasterSil 151Med has an exceptionally low viscosity enabling it to be highly desirable for potting and encapsulation. First and foremost, MasterSil 151Med, as is true with silicones in general, offers remarkable flexibility and high temperature resistance. It has superb electrical insulation properties. The system’s flexibility allows it to withstand severe thermal cycling and resist vibration and shock. MasterSil 151Med resists gamma radiation, EtO and various chemical sterilants. These properties enable this system to be well suited for medical applications involving optical and electrical components. It can also be used for encapsulating electronic circuitry, LEDs, optical fibers and other optical components in a wide array of medical devices. MasterSil 151Med is transparent and has a service temperature range of -65°F to +400°F. It fully passes USP Class VI testing for biocompatibility. Product Advantages Addition cured; no by-products released during cure; does not require air for curing Low exotherm; very long pot life; low viscosity ideal for potting and encapsulation Readily cures at ambient temperatures or faster cure at elevated temperatures

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