OverviewOne-component, dual-cure (UV + heat) epoxy system formulated for medical device bonding and sealing; passes ISO 10993-5 for cytotoxicity.
Key Features- Low viscosity for good wetting and dispensing
- Minimal shrinkage on cure to maintain dimensional stability
- High optical clarity for transparent assemblies
- Heat-curing capability (110–125°C) ensures cure in shadowed or masked areas
Typical Properties- Viscosity: Part A: 500–3,500 cps (Part B not specified)
- Hardness: 80–90 Shore D
- Service temperature range: -60°F to +500°F
- Dielectric constant: 3.85
- Glass transition temperature (Tg): 160–170°C
Cure ScheduleInitial UV exposure at 320–365 nm with 20–40 mW/cm² induces rapid surface cross-linking. Apply heat at 110–125°C for 60–90 minutes to complete polymerization in non‑exposed areas. A post cure at 120–150°C for 1–2 hours is recommended to optimize mechanical strength, chemical resistance, and Tg.
Product DescriptionMaster Bond UV26DCMed is a one-component, dual-cure epoxy designed for medical applications where reliable bonding and sterilization resistance are required. UV light provides fast cure on exposed surfaces while heat completes cure throughout complex geometries. The formulation resists a wide range of sterilants (including ethylene oxide, glutaraldehyde and multiple hydrogen peroxide systems such as STERRAD™) and endures repeated steam autoclaving.
Product Advantages- No mixing—single-component handling
- Effective cure in shadowed areas with heat
- No oxygen inhibition—consistent surface cure
- High mechanical strength and dimensional stability
- Withstands repeated sterilization cycles including autoclaving
- Passes ISO 10993-5 for cytotoxicity
Applications- Bonding of metals, glass, ceramics and most plastics
- Sealing of assemblies requiring sterilization resistance
- Manufacture and repair of reusable medical instruments
Certifications- ISO 10993-5 for Cytotoxicity
- Complies with EU Directive 2015/863 (RoHS)
PackagingTechnical specifications- Product name: UV26DCMed
- Brand: Master Bond
- Type: One-component, dual-cure (UV + heat) epoxy system
- UV activation: 320–365 nm at 20–40 mW/cm² (typical)
- Heat cure: 110–125°C for 60–90 minutes
- Post cure: 120–150°C for 1–2 hours (longer improves properties)
- Viscosity: Part A: 500–3,500 cps (Part B not specified)
- Hardness: 80–90 Shore D
- Service temperature range: -60°F to +500°F
- Dielectric constant: 3.85
- Glass transition temperature (Tg): 160–170°C
- Optical: High optical clarity
- Shrinkage: Minimal shrinkage upon curing
- Sterilization resistance: Resistant to ethylene oxide, glutaraldehyde, multiple hydrogen peroxide systems (including STERRAD™) and repeated steam autoclaving
- Substrate compatibility: Bonds to metals, glass, ceramics, most plastics
- Other: Not oxygen inhibited; excellent dimensional stability; good electrical insulating properties; recommended for reusable medical instruments