BUILDING AREA - 705 x 250 x 190 mm
Z RESOLUTIO - > 0,2 m m
XY PRECISION - ± 0,2 m m
NOZZLE - 0,4 mm - Temp Max 260 °C
HEATED BED - <90 °C
SOFTWARE - Slic 3 r - Si m p lify 3d
CONNECTIVITY - SD Card
AUTO LEVELING Z - N o
FILAMENT SENSOR - integrated
SIZE - 955 x 470 x 445 mm
WEIGHT - 38 Kg