Inspection camera Linea HS2

for life sciences applicationsline-scanCMOS

Overview
The Linea HS2 is a TDI line scan camera engineered for ultra-high-speed imaging in low-light environments. It is available with 8192 or 16384 horizontal resolution, uses a backside-illuminated multi-array charge-domain TDI CMOS sensor with 5 µm pixels, and supports a maximum line rate of 1 MHz. Dual Camera Link HS (CLHS) CX4 connectors and active optical cable options provide high-throughput, EMI-immune connectivity.

Key Features

• Backside-illuminated (BSI) multi-array charge-domain TDI CMOS sensor
• Selectable horizontal resolutions: 8192 or 16384 (multi-array TDI architecture)
• 5 µm pixel size
• Maximum line rate: 1 MHz (1000 kHz)
• Dual CLHS CX4 interfaces delivering up to 16 GB/s aggregate throughput
• On-chip binning to increase web speeds and throughput
• Configurable modes to prioritize line rate, dynamic range, or full well depending on application
• Active Optical Cables (AOC) for EMI immunity and extended cable lengths
• Designed as a drop-in upgrade for previous Linea HS models (same pixel size, optics, cables, mounting)

Complete Imaging Solution
Linea HS2 integrates with Teledyne’s Xtium3 CLHS frame grabbers (for example, Xtium3 CLHS PX8) to exploit next-generation CLHS capabilities. The system supports parallel data forwarding across multiple PCs (up to 12) and AOC connectivity for cable lengths beyond 100 meters while preserving signal integrity.

Typical Applications

• Semiconductor wafer inspection
• High-density packaging inspection
• Flat panel display (FPD) inspection
• Gene sequencing
• Digital pathology

Family Highlights / Table
Camera Type: TDI Line Scan
Sensor Technology: CMOS (BSI, multi-array charge-domain TDI)
Supported Interfaces: Camera Link HS (CLHS)
Spectrum Capability: UV (350–400 nm), Visible (400–700 nm), NIR (700–1000 nm)

Technical Specifications

• Resolutions: 8192 x 288 and 16384 x 288 (multi-array TDI configuration)
• Pixel size: 5 µm
• Sensor: Backside-illuminated multi-array charge-domain TDI CMOS
• Max line rate: 1000 kHz (1 MHz)
• Interfaces: Dual Camera Link HS (CLHS) CX4 connectors
• Data throughput: up to 16 GB/s (dual CLHS)
• On-chip binning: supported
• Optical connectivity: Active Optical Cables (AOC) for EMI immunity and >100 m cable lengths
• System compatibility: Compatible with Xtium3 CLHS frame grabbers; supports parallel multi-PC data forwarding
• Spectral sensitivity: UV (350–400 nm), Visible (400–700 nm), NIR (700–1000 nm)