TORREY PINES SCIENTIFIC WAFERPLATE™ MODEL HP90 FULLY PROGRAMMABLE DIGITAL BAKE PLATE
DESIGNED SPECIFICALLY FOR BAKING SILICON WAFERS
Large circular milled-flat aluminum surface with temperature uniformity better than 1% across the heating surface. Designed specifically for working with 12” (304.8mm) diameter or smaller silicon wafers and other samples where temperature accuracy and surface uniformity are a must.
13.875 in (354.24 mm) diameter heater surface.
Milled flat plate aluminum ideal for 12 in (304.8 mm) or smaller silicon wafers
Controllable remotely from a PC or industrial controller via RS232 I/O port with full access to all parameters or data
Bench top controllable and programmable using the remote controller provided
Temperature range from room temperature to 350 °C
Readable and settable to 1 °C
Accuracy 1% of setting
Uniformity of temperature from the middle of the plate surface to within 0.75 in of the sides is better than 1%
Temperature stability ± 1 °C
Calibrated to 0.1 °C for guaranteed accuracy
Remote controller enables storing 5 individual programs with up to 10 steps per program for a variety of hands-off, repeatable sample runs
Programs automatically repeatable from 1 to 99 times or infinitely if wanted
Ramp temperatures up or down at 1 °C/hour increments from 1 °C to 450 °C