<b>Overview</b><br><ul><li>6th/7th Gen Intel® Core™ processor platform with Intel® H110 chipset and DDR4 memory</li><li>Support dual display VGA + HDMI™</li><li>On-board internal power connector for providing power to add-on cards</li><li>Flexible hardware expansion with PCI/PCIe backplane options</li></ul><br><br><b>Form factor / Core platform</b><br>Form factor: SBC Form Factor<br>CPU: Intel 7th Gen Core CPU • Intel® Core™ i5-6500TE (2.3 GHz, quad-core, TDP=35W)<br>Chipset: Intel® H110<br>System Memory: 2 x 260-pin DDR4 SO-DIMM, one 4 GB pre-installed (system max: 32GB)<br><br><b>Power & Reliability</b><br>Power: Input - DC Jack: 9 V~36 V DC, Terminal Block: 9 V~36 V DC • Consumption example: 19
[email protected] A (Intel® Core™ i7-6700TE with 8 GB memory) • Internal Connector: 5V@3A or 12V@3A<br>Reliability: Operating Shock - Half-sine wave shock 5G, 11ms, 100 shocks per axis • Non-Operating Shock - Half-sine wave shock 15G, 11ms, 100 shocks per axis • Operating Vibration - MIL-STD-810G 514.6C-1 (with SSD) • Non-Operating Vibration - Half-sine mode IEC-60068-2-06 • Safety/EMC - CE/FCC<br><br><b>I/O Interface</b><br><ul><li>USB: 4 x USB 3.0</li><li>Ethernet: 2 x RJ-45 PCIe GbE by RTL8111G controller</li><li>COM Port: 2 x RS-232/422/485 (DB-9, with 2.5kV isolation)</li><li>Display: 1 x VGA (up to 1920 x 1200 @60Hz), 1 x HDMI™ 1.4 (up to 3840 x 2160 @30Hz)</li><li>Audio: 1 x Line-out, 1 x Mic-in</li></ul><br><br><b>Expansion Slots</b><br>PCIe Mini: 2 x Full-size PCIe Mini slots (one supports mSATA, co-lay with SATA)<br>Backplane options: 3A: 1 x PCIe x16, 2 x PCI • 3B: 1 x PCIe x16, 1 x PCIe x4, 1 x PCI<br><br><b>System</b><br>Cooling method / System Fan: Fanless<br>Drive Bays: 2 x 2.5” SATA 6Gb/s HDD/SSD bays<br><br><b>Indicator & Buttons</b><br>Buttons: 1 x Power Button • 1 x Reset Button • 1 x AT/ATX Switch<br><br><b>Physical Characteristics</b><br>Construction: Extruded aluminum alloy housing<br>Color: Dark silver purple + Silver<br>Dimensions: 132.6 x 255.2 x 190 (W x D x H) mm<br>Weight: 4.2 kg (typ.) / 6.3 kg (with options)<br><br><b>Environment</b><br>Operating Temperature: i7-6700TE: -20°C ~ 50°C with airflow (SSD) • i5-6500TE: -20°C ~ 60°C with airflow (SSD)<br>Humidity: 10% ~ 95%, non-condensing<br><br><b>Ordering Information</b><br>TANK-870e-H110-i5/4G/3B-R12: Ruggedized fanless embedded system with Intel® Core i5-6500TE 2.3GHz (up to 3.3 GHz, 4-Core, TDP 35W), 4GB DDR4 pre-installed, 1 x PCIe x16 & 1 x PCIe x1 & 1 x PCI expansion, VGA/HDMI, 9~36V DC, powder paint, RoHS<br>TANK-870e-H110-i5/4G/3A-R12: Ruggedized fanless embedded system with Intel® Core i5-6500TE 2.3GHz (up to 3.3 GHz, 4-Core, TDP 35W), 4GB DDR4 pre-installed, 1 x PCIe x16 & 2 x PCI expansion, VGA/HDMI, 9~36V DC, powder paint, RoHS<br><br><b>Package Contents</b><br><ul><li>1 x Chassis Screw</li><li>1 x Mounting Bracket</li></ul><br><br><b>Technical specifications</b><br><ul><li>Model: TANK-870e-H110</li><li>Brand: IEI</li><li>CPU options: Intel 6th/7th Gen Core family (example: i5-6500TE)</li><li>Chipset: Intel® H110</li><li>Memory: 2 x DDR4 SO-DIMM (1 x 4GB pre-installed, max 32GB)</li><li>Storage: 2 x 2.5” SATA 6Gb/s bays; mSATA support via PCIe Mini</li><li>I/O: 4 x USB 3.0, 2 x GbE, 2 x isolated COM (RS-232/422/485), VGA, HDMI, Line-out, Mic-in</li><li>Expansion: PCIe x16 plus PCI/PCIe slots depending on backplane variant; full-size PCIe Mini slots</li><li>Power input: 9–36 V DC (DC jack or terminal block)</li><li>Cooling: Fanless rugged design</li><li>Dimensions / Weight: 132.6 x 255.2 x 190 mm / 4.2 kg (typ.)</li><li>Operating temperature: down to -20°C (depending on CPU) and up to 50–60°C with airflow</li><li>Compliance / Reliability: MIL-STD shock/vibration figures; CE/FCC</li></ul>