<b>Overview</b><br>iEi TANK-XM810 modular edge AI inference system. High-performance fanless embedded computer supporting 10th and 11th Generation Intel® Core™ processors, multiple I/O combinations and a modular expansion ecosystem. Engineered for harsh industrial environments including digital surveillance, transportation, machine vision and advanced manufacturing. Compatible with iEi eChassis modules and optional eBP backplanes for scalable expansion.<br><br><b>Key Features</b><br><ul><li>Supported CPUs: Intel® Core™ i3 / i5 / i7 (10th / 11th Gen) — examples: i3-10100TE, i3-10320, i5-10500, i5-10500TE, i7-10700E, i7-10700TE</li><li>2 x 2.5GbE ports (Intel® controllers)</li><li>Multiple USB ports (USB 3.2 Gen2 and USB 2.0) and multiple serial ports (RS-232/422/485)</li><li>Internal expansion boards and optional backplanes for flexible configurations</li><li>Optional eChassis expansion boxes for GPUs/accelerators and up to eight 2.5GbE PoE+ ports via PoE modules</li><li>CE and FCC compliant</li></ul><br><b>Performance</b><br>The TANK-XM810 supports up to 8 cores / 16 threads (65W CPU support) and DDR4-2933 memory for low-latency edge processing. It consolidates multiple workloads for industrial AI inference and machine vision tasks, delivering deterministic responsiveness at the edge.<br><br><b>Expansion and Modularity</b><br>Supports iEi eChassis modules (e.g. TXC-XM81-G1 / TXC-XM81-G2) to add GPU and PCIe add-on cards. Multiple optional backplanes (TXCBP-XM81 variants) provide up to seven configuration options. Dual-power input and an optional power board (IDD-X1228150) enable additional power for accelerators and GPUs.<br><br><b>Ruggedness & Thermal Design</b><br>Fanless pin-fin heatsink design improves two-dimensional heat conduction and reduces flow impedance for reliable passive cooling. Operating temperature range from -20°C to 60°C depending on CPU TDP and cooling configuration. Designed for vibration and shock environments with SSD protection characteristics. External 4-pin fan connector available for optional active cooling.<br><br><b>Connectivity & Wireless</b><br>Wireless-ready via iEi Wireless Expansion Module with M.2 and Mini PCIe slots, supporting Wi-Fi 6 and Bluetooth 5.0. Dual SIM sockets for LTE redundancy and 5G readiness via add-on cards. Optional PoE/LAN daughterboards provide PoE+ options for powered devices.<br><br><b>Display & Graphics</b><br>Integrated Intel® UHD Graphics (UHD 630) supporting 4K output and dual independent displays via 1 x DP++ and 1 x HDMI 1.4 output.<br><br><b>Versatile I/O</b><br>Standard front and rear I/O includes multiple USB, COM ports, digital I/O and high-speed Ethernet. Expandable with internal M.2 NVMe/PCIe slots and optional daughterboards for PoE, wireless or acceleration cards.<br><br><b>Ordering & Variants</b><br><ul><li>TANK-XM810-i7BC-R12 — Intel® i7-10700E (65W), 8GB DDR4 pre-installed</li><li>TANK-XM810-i7AC-R12 — Intel® i7-10700TE (35W), 8GB DDR4 pre-installed</li><li>TANK-XM810-i5BC-R12 — Intel® i5-10500 (65W), 8GB DDR4 pre-installed</li><li>TANK-XM810-i5AC-R12 — Intel® i5-10500TE (35W), 8GB DDR4 pre-installed</li><li>TANK-XM810-i3BC-R12 — Intel® i3-10320 (65W), 8GB DDR4 pre-installed</li><li>TANK-XM810-i3AC-R12 — Intel® i3-10100TE (35W), 8GB DDR4 pre-installed</li></ul><br><b>Package Contents (typical)</b><br><ul><li>1 x Wall mounting kit</li><li>1 x Screw pack</li><li>2 x Terminal block</li></ul><br><b>Technical specifications</b><br><ul><li>CPU: 10th / 11th Gen Intel® Core™ options (examples listed above)</li><li>Chipset: Q470 / Q470E</li><li>System memory: 2 x SO-DIMM DDR4 2933 MHz (up to 64 GB)</li><li>Power input: DC jack or terminal block 12 V ~ 28 V DC</li><li>Typical consumption example: 12V @ 8A (for high-performance configuration)</li><li>I/O Ports: 6 x USB 3.2 Gen2, 2 x USB 2.0; 2 x 2.5GbE (RJ-45); multiple RS-232/422/485 ports; 12-bit DIO (6-in/6-out); 1 x HDMI; 1 x DP++</li><li>TPM: Intel Platform Trust Technology (Intel® PTT) supported</li><li>Watchdog Timer: Programmable 1 ~ 255 sec/min</li><li>Expansion: M.2 — 2 x 2280 M-key (PCIe x2) with RAID 0/1 support; optional backplane support for multiple PCIe/PCI slots and eChassis</li><li>Drive bays: 1 x 2.5” SATA 6 Gb/s HDD/SSD bay</li><li>Cooling: Fanless; 4-pin external system fan connector for optional active cooling</li><li>Construction: Extruded aluminum alloy</li><li>Color: Black</li><li>Dimensions (W x D x H): 230.6 x 256.04 x 76.2 mm</li><li>Weight: approx. 3.2 / 3.5 kg (depending on configuration)</li><li>Operating temperature: -20°C ~ 60°C (with airflow, depends on CPU TDP and SSD); some 65W configurations limited to -20°C ~ 50°C</li><li>Humidity: 10% ~ 95% non-condensing</li><li>Operating vibration / shock: SSD shock/vibration protection (manufacturer data)</li><li>Safety & EMC: CE / FCC compliant</li><li>OS Compatibility: Microsoft Windows 10 / Windows 11, Linux</li></ul>