Production system PlasmaPro 80 ICP RIE

The PlasmaPro 80 ICP is a compact, small footprint system offering versatile ICP etch solutions with convenient open loading. It is easy to site and easy to use, with no compromise on process quality. The open load design allows fast wafer loading and unloading, ideal for research, prototyping and low-volume production. It enables high performance processes using optimised electrode cooling and excellent substrate temperature control. Open load design allows fast wafer loading and unloading Excellent etch control and rate determination Excellent wafer temperature uniformity Up to 200mm wafers Low cost of ownership Built to Semi S2/S8 standards Applications III-V etch processes Silicon Bosch and cryo-etch processes SiO2 and quartz etch Failure analysis dry etch de-processing ranging from packaged chip and die etch through to full 200mm wafer etch Hard mask deposition and etch for high brightness LED production Features Small footprint - Easy to site Optimised electrode cooling - Substrate temperature control High-conductance radial (axially symmetric) pumping configuration - Guaranteed enhanced process uniformity and rates are Addition of < 500ms data logging - Traceability and history of chamber and process conditions Close-coupled turbo pump - High pumping speed and excellent base pressure Clear ease of access to key components - Improved serviceability and maintenance X20 control system - Greatly increases data retrieval and delivers faster, more repeatable matching Fault and tool diagnostics via front end software - Rapid fault diagnosis