Optical inspection system VISILAB V2

automatedcomputer-controlledfor the pharmaceutical industry

Product overview
The VISILAB V2 is an EU-certified automated statistical control metrology system for coins and blanks. It replaces manual measurement by delivering a final report suitable for batch release in quality control. The system handles both blanks and circulated coins.

Features

• Model: VISILAB V2
• Inspection capability: automated coin and blank metrology
• Processes up to 250 coins or blanks in 30 minutes
• Key parameters measured: Outer Diameter, Ovality, Rim Height, Flatness, Conductivity, Plating Thickness, Weight
• Material compatibility: Bi-metal, Copper, Steel, Nickel, Aluminium
• User convenience: Self-calibrating cameras, Simple touchscreen interface, No setup required for circulating coins
• Dimensions: 1,860 x 650 x 1,500 mm
• Weight: Approx. 300 kg
• Optional features: Electro-magnetic property measurement, Field thickness analysis

Other inspection solutions (overview)

• VISIA – Advanced blank & coin inspection
• Throughput: Up to 200,000 coins or blanks per hour
• Versatility: Compatible with various shapes (round, scalloped, bi-metallic) and materials (nickel, copper alloys, steel, aluminium)
• Inspection precision: 100% surface inspection with cutting-edge 4-color matrix cameras
• User-friendly operation: Intuitive touchscreen interface and open architecture for easy maintenance

Technical specifications

• Model: VISILAB V2
• Certification: EU-certified automated statistical control measurement tool
• Throughput (typical): Processes up to 250 coins or blanks in 30 minutes
• Measured parameters: Outer Diameter; Ovality; Rim Height; Flatness; Conductivity; Plating Thickness; Weight
• Material compatibility: Bi-metal, Copper, Steel, Nickel, Aluminium
• User interface: Touchscreen
• Calibration: Self-calibrating cameras
• Setup: No setup required for circulating coins
• Dimensions (W x D x H): 1,860 x 650 x 1,500 mm
• Weight: Approx. 300 kg
• Optional measurements: Electro-magnetic property measurement; Field thickness analysis