The Triple Ion Beam Milling System, EM TIC 3X allows production of cross sections and planar surfaces for Scanning Electron Microscopy (SEM), Microstructure Analysis (EDS, WDS, Auger, EBSD) and, AFM investigations.
With the EM TIC 3X you achieve high quality surfaces of almost any material at room temperature or cryo, revealing the internal structures of the sample in a near native state as possible.
What really counts regarding the efficiency of an ion beam miller is excellent quality results with high throughput. It’s not enough that we could increase the milling rate by a factor of 2 compared to the previous version but the unique triple ion beam system optimizes the preparation quality and reduces working time.
Up to three samples can be processed in one session. Cross sectioning and polishing can be performed by one stage.
Workflow solutions provide safe and efficient transfer of samples to subsequent preparation instruments or analysis systems.