Automatic sample preparation system EM TIC 3X

laboratoryfor electron microscopybenchtop

Create high-quality milling surfaces using three broad beams, revealing true sample structures for downstream Electron Microscopy analysis. Adaptable and flexible, the EM TIC 3X supports a broad range of experiments with easily exchangeable stages and sample holder compatibility. Precise Surface Preparation. Simplified by Design. Your Benefits Standard Workflow Solution Surface preparation workflow connectivity Maintain consistent sample orientation and support. Use the same holder for EM TXP and EM TIC 3X, increasing efficiency and reducing handling steps. Ensure accuracy and efficiency throughout the surface preparation workflow. Multiple sample stage Simple by design, configure and expand to your needs Enable new experiments with easily exchangeable stages. Achieve desired outcomes through intuitive design, reducing errors and setup time. Expand EM TIC 3X without downtime. Cross section of veneer Reveal true structure and composition of the sample EM TIC 3X prepares buried structures for EM analysis providing pristine surface quality, aligning samples precisely, and efficiently milling multi-layered foils with minimal redeposition and delamination. Efficiently prepare foil samples Prepare cross-sections of single or multiple layers of foils with minimal redeposition or delamination. Successfully mill a variety of foil types to eliminate the artifacts from mechanical preparation and enable high-resolution SEM analysis of battery components. Simply bring your sample through the workflow Increase efficiency and reduce handling steps with sample support compatibility. Use the same holder for EM TXP and EM TIC 3X for the whole surface preparation workflow.