Automatic sample preparation system EM TXP

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EM TXP is a mechanical cross-sectioning device that precisely downsizes samples for visual inspection. With EM TXP you can optimize sample pre-preparation to minimize ion beam milling time and ensure creation of mirror-like surfaces for light microscopy inspection. Streamlined preparation for electron microscopy observation Prepare samples with buried structures for broad ion beam milling. Sample polishing in EM TXP Accurate sample preparation for light microscopy visual inspection Prepare mirror-like surfaces for light microscopy inspection. Scroll to feature Hard sample cross-sectioning using flat sample holder and diamond disc saw with 30µm grain size. Surface preparation workflow connectivity Maintain consistent sample orientation and support. uried structures prepared for broad ion beam milling Multi-tool capabilities offer the right accessory for each process step, precisely honing in on your area of interest, and accurately positioning tool rotation and tilt angle. Precise pre-cutting uncovers structures buried in the sample and shortens ion beam milling time by removing unwanted material. Fine-polished cross-section surface Prepare surfaces that meet your precision needs of light microscopy inspection. Precisely polish cross-section surface for visual inspection. Reveal your sample structure safely under stereo microscope observation. Simply bring your sample through the workflow Increase efficiency and reduce handling steps with sample support compatibility. Use the same holder for EM TXP and EM TIC 3X for the whole surface preparation workflow.