Epoxy medical assembly adhesive EP21LVMed
epoxy resinfor medical devicesfor ceramics

Epoxy medical assembly adhesive - EP21LVMed - Master Bond - epoxy resin / for medical devices / for ceramics
Epoxy medical assembly adhesive - EP21LVMed - Master Bond - epoxy resin / for medical devices / for ceramics
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Characteristics

Chemical composition
epoxy, epoxy resin
Applications
for medical devices
Type of substrate
for ceramics, for metal, for rubber, glass, for plastics
Other characteristics
low-viscosity, biocompatible

Description

Product Description
EP21LVMed is a two-component, low-viscosity medical-grade epoxy formulated for high-performance bonding, sealing, coating, casting, encapsulating and potting in medical device and healthcare applications. It cures at room temperature or faster at elevated temperatures. Recommended cure schedule for optimized properties and biocompatibility: overnight at room temperature followed by 2–3 hours at 150–200°F. The system mixes 1:1 by weight and contains no solvents or diluents. Color: Part A clear, Part B amber.

Key Features
  • Meets USP Class VI medical requirements
  • Passes ISO 10993-5 cytotoxicity testing
  • Excellent thermal cycling resistance
  • Room-temperature or elevated-temperature cure
  • Wide chemical resistance including EtO, radiation and many cold sterilants
  • Serviceable from -65°F to +250°F


Typical Properties
  • Viscosity: Part A: 10,000–14,000 cps; Part B: 11,000–15,000 cps
  • Mix ratio: 1:1 by weight
  • Cure schedule: overnight at 75°F followed by 1–2 hours at 150–200°F (recommended: overnight at room temperature then 2–3 hours at 150–200°F for biocompatibility)
  • Hardness: >70 Shore D
  • Service temperature range: -65°F to +250°F
  • Dielectric strength: 440 volts/mil
  • Tensile lap shear strength: >2,800 psi


Product Advantages
  • Convenient 1:1 mix ratio by weight
  • Easy application; adhesive spreads readily and requires only contact pressure during cure
  • High bond strength to metals, glass, ceramics, wood, rubbers and many plastics
  • Good electrical insulation — suitable for potting and encapsulation
  • Resistant to EtO, radiation and many chemical sterilants


Applications
  • Medical device bonding
  • Sealing and coating of components
  • Potting and encapsulation of electronics
  • Casting and structural bonding
  • Where biocompatibility and sterilization resistance are required


Certifications
  • ISO 10993-5 (cytotoxicity)
  • USP Class VI medical
  • Complies with EU Directive 2015/863 (RoHS)


Packaging Options (examples)
  • Cans
  • Double barrel cartridge
  • FlexiPack
  • Gun applicator
  • Premixed & frozen syringe
  • Syringes


Technical specifications
  • Mix ratio: 1:1 by weight
  • Mixing: convenient one-to-one mixing; no solvents or diluents
  • Cure: room temperature or elevated temperature; recommended post-cure for biocompatibility
  • Viscosity (Part A / Part B): 10,000–14,000 cps / 11,000–15,000 cps
  • Hardness: >70 Shore D
  • Dielectric strength: 440 volts/mil
  • Tensile lap shear strength: >2,800 psi
  • Service temperature range: -65°F to +250°F
  • Color: Part A clear; Part B amber
  • Biocompatibility: passes USP Class VI and ISO 10993-5 cytotoxicity testing
  • Chemical resistance: resists water, acids, bases, EtO, radiation and many cold sterilants
  • Substrates: metals, glass, ceramics, wood, rubbers, many plastics
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.