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Certifications
- ISO
Master Bond
... highly flowable Low tensile modulus High elongation Meets ISO 10993-5 Master Bond UV17Med is a one-part, UV-curable adhesive specifically designed for bonding challenging TPUs, offering excellent toughness and high elongation (50-60%). ...
Master Bond
... resistance to EtO, radiation, chemical sterilization media and autoclaving.It can be used for both reusable and disposable medical devices. In very thin sections, this system will transmit light, but in thicker ones, it is opaque. Also, ...
Master Bond
... Two part epoxy system for bonding, sealing, coating and potting that meets USP Class VI and ISO 10993-5 for medical applications Key Features Very fast curing; quick handling time Highly resistant to chemical sterilants Exellent ...
Master Bond
... Silver conductive, two component epoxy for medical applications Key Features: - Convenient handling - High electrical conductivity - Thermally conductive - Capable of withstanding thermal cycling - Good strength properties - USP Class ...
Master Bond
... Description
EP21LVMed is a two-component, low-viscosity
medical-grade epoxy formulated for high-performance bonding, sealing, coating, casting, encapsulating and potting in
medical device and healthcare applications. ...
Master Bond
... to use, with very high thermal and electrical conductivity, while meeting the medical grade criteria mentioned previously. It should be considered in applications with medical devices, where heat curing at 250-300°F is ...
Master Bond
... Low viscosity, two component epoxy system Key Features Biocompatible as per USP Class VI testing Passes ISO 10993-5 for cytotoxicity Meets certification for indirect contact with food Resistant to chemical sterilants Optically ...
Master Bond
... sterilants, EtO, radiation, and especially autoclaving. It is brown to tan in color. This medical grade formulation is ideal for disposable and non-disposable medical device manufacturing requiring fast, high-performance ...
Master Bond
... and cures at room temperature or more rapidly at elevated temperatures.
Applications
- Medical device assembly
- Potting and encapsulation of electronic components
- Sealing and
Master Bond