Pressure sensor MEAS 1620

medicalmonitoringdisposable

Overview
The 1620 series disposable pressure sensor is a fully piezoresistive silicon sensor designed for invasive blood pressure monitoring and for direct installation into disposable blood pressure housings. The sensor meets AAMI (Association for the Advancement of Medical Instrumentation) requirements for blood pressure transducers. Construction includes a pressure sensing element on a ceramic substrate with laser-trimmed thick-film resistors for compensation and calibration, a protective plastic cap, and a dielectric gel for electrical and fluid isolation. Sensors are batch-manufactured in a 10x12 element array and shipped in anti-static containers. OEM packaging and performance options are available.

Features

• Designed for disposable medical blood pressure applications
• Compact hybrid package with SMD pads for automated assembly
• Dielectric gel interface for electrical and fluid isolation
• Operating temperature range 5 °C to 40 °C
• Typical sensitivity 5.0 uV/V/mmHg
• Replacement accuracy: ±1.0% FSO
• Customization and OEM options available

Product Type Features

• Leg Style: SMD pads
• Sensor Package: Hybrid assembly
• Pressure Sensor Type: Disposable medical pressure sensors
• Pressure Type: Gauge

Electrical Characteristics

• Supply Voltage: 6 V

Dimensions

• Width: 10.54 mm [0.415 in]
• Length: 8.10 mm [0.32 in]
• Height: 3.53 mm [0.139 in]

Usage Conditions

• Operating Temperature Range: 5 – 40 °C [41 – 104 °F]

Operation / Application

• Pressure Range: -50 – 300 mmHg
• Proof Pressure: 125 psi
• Output Signal: Sensitivity = 5.0 uV/V/mmHg
• Pressure Accuracy: ±1.0% FSO

Sensor Options

• Narrow hole
• No option
• Wide hole

Technical specifications

• Series: 1620 series
• Type: Fully piezoresistive silicon pressure sensor for invasive blood pressure monitoring
• Sensitivity: 5.0 uV/V/mmHg
• Pressure range: -50 to 300 mmHg
• Proof pressure: 125 psi
• Accuracy: ±1.0% FSO
• Supply voltage: 6 V
• Operating temperature: 5 – 40 °C
• Package & mounting: Hybrid assembly with SMD pads
• Typical manufacturing: 10x12 element array (120 units per substrate)