電子検査システム SE3000-DD™医療
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Product Overview
SE3000DD SPI system combines industry-leading Multi-Reflection Suppression (MRS) sensor technology, enabling detailed identification of glossy parts and reflective solder joints, achieving both measurement accuracy and production speed.
Effectively suppressing multiple reflections is crucial for high-precision measurement, and MRS is an ideal technical solution for a wide range of applications, especially those requiring very high quality standards.
CyberOptics further enhances resolution with its proprietary advanced Multi-Reflection Suppression (MRS) sensor. The ultra-high-resolution MRS sensor strengthens the SE3000 DD platform, delivering excellent inspection performance ideal for 0201 measurement processes and microelectronics applications that demand higher accuracy and inspection reliability.
The SE3000DD 3D Solder Paste Inspection (SPI) system extends the award-winning SE3000™ 3D SPI platform, achieving the highest level of flexibility.
The dual-lane, dual-sensor system maximizes flexibility by accommodating various PCB widths. Its unique design allows for inspection of different board sizes on different lanes, or easy switching from dual-lane mode to single-lane mode for inspecting very large boards.
SE3000 DD not only enables flexible PCB inspection but also allows selection of the same or two different MRS sensors for maximum flexibility.
The Solder Paste Inspection V5 Series Software offers a world-class user experience with an intuitive interface, completely revolutionizing the way users interact with the system.
Equipped with a complete multi-touch experience, the V5 Series software provides a suite of innovative features for smart and rapid inspection.
SE3000DD SPI system combines industry-leading Multi-Reflection Suppression (MRS) sensor technology, enabling detailed identification of glossy parts and reflective solder joints, achieving both measurement accuracy and production speed.
Effectively suppressing multiple reflections is crucial for high-precision measurement, and MRS is an ideal technical solution for a wide range of applications, especially those requiring very high quality standards.
CyberOptics further enhances resolution with its proprietary advanced Multi-Reflection Suppression (MRS) sensor. The ultra-high-resolution MRS sensor strengthens the SE3000 DD platform, delivering excellent inspection performance ideal for 0201 measurement processes and microelectronics applications that demand higher accuracy and inspection reliability.
The SE3000DD 3D Solder Paste Inspection (SPI) system extends the award-winning SE3000™ 3D SPI platform, achieving the highest level of flexibility.
The dual-lane, dual-sensor system maximizes flexibility by accommodating various PCB widths. Its unique design allows for inspection of different board sizes on different lanes, or easy switching from dual-lane mode to single-lane mode for inspecting very large boards.
SE3000 DD not only enables flexible PCB inspection but also allows selection of the same or two different MRS sensors for maximum flexibility.
The Solder Paste Inspection V5 Series Software offers a world-class user experience with an intuitive interface, completely revolutionizing the way users interact with the system.
Equipped with a complete multi-touch experience, the V5 Series software provides a suite of innovative features for smart and rapid inspection.
- Highest flexibility for improved throughput: The dual-lane, dual-sensor SE3000-DD, with a smaller footprint than other standard systems, offers maximum flexibility for various PCB widths with a smart conveyor design solution. Its unique design allows for inspection of different board sizes on different lanes, or easy switching from dual-lane to single-lane mode for very large boards. SE3000-DD enables both synchronous and asynchronous inspections, as well as rapid inspection of different programs on different lanes.
| Inspection Speed | Standard MRS Sensor: 35 cm²/sec (2D+3D) | Ultra-high-resolution MRS Sensor: 15 cm²/sec (2D+3D) |
| PCB Size (Max) | SE3000 DD: Single lane: 510 x 510 mm (20 x 20 in), Dual lane: 350 x 320 mm (13.7 x 12.5 in) | SE3000 D: Single lane: 510 x 510 mm (20 x 20 in), Dual lane: 510 x 320 mm (20 x 12.5 in) |
| Field of View (FOV) | Standard MRS Sensor: 36 x 36 mm | Ultra-high-resolution MRS Sensor: 21 x 21 mm |
| Resolution | Standard MRS Sensor: 18µm | Ultra-high-resolution MRS Sensor: 9µm |
| Minimum Component Size | Standard MRS Sensor: 0402 mm (01005 in) Ultra-high-resolution MRS Sensor: 0201 mm (008004 in) |
| Component Height Clearance | Top: 50 mm (1.96 in), Bottom: 30 mm (1.18 in) |
- Industry-leading Multi-Reflection Suppression (MRS) sensor technology
- High-precision measurement and high-speed inspection
- Flexible dual-lane, dual-sensor system for various PCB widths
- Selectable standard or ultra-high-resolution MRS sensors
- Intuitive V5 Series software with multi-touch support
- Minimum component size: 0201 mm (008004 in) with ultra-high-resolution sensor
- Maximum PCB size: up to 510 x 510 mm (single lane)
- Inspection speed: up to 35 cm²/sec (standard sensor)
- Resolution: up to 9µm (ultra-high-resolution sensor)
- Component height clearance: Top 50 mm, Bottom 30 mm
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