Image interpretation module ECM-C114

data processingmedical imagingserial line

Product introduction
ECM-C114 is a COM Express Type 6 Compact module (95×95mm) based on Intel 11th Gen Tiger Lake‑U processors. It integrates Intel Iris Xe graphics, dual‑channel DDR4 SO‑DIMM support up to 64GB, multiple display outputs and comprehensive I/O tailored for industrial automation, machine vision and edge computing applications.

Product features

• Intel 11th Gen Tiger Lake‑U CPUs: i3‑1115G4 / i5‑1135G7 / i7‑1165G7 (28W TDP)
• COM Express Type 6 Compact form factor, 95×95mm
• Dual‑channel DDR4‑3200, 2×SO‑DIMM, up to 64GB
• Integrated Intel Iris Xe GPU; 3×DDI (configurable HDMI/DVI/DP) + eDP/LVDS option
• Display support: HDMI up to 4096×2304@24Hz; DP/eDP up to 4096×2304@60Hz; VGA up to 2048×1536@50Hz
• Expansion: 2×PCIe x4 + 1×PCIe x1; Intel i211‑AT Gigabit Ethernet
• I/O: 4×USB3.0, 8×USB2.0, 2×SATA3.0, 2×SER, HDA, 8‑bit GPIO, I2C, SMBus, watchdog, TPM 2.0
• Wide operating/storage range and ATX/AT power input

Detailed description
The ECM‑C114 supports Intel Tiger Lake‑U processors delivering up to 4 cores/8 threads and Turbo frequencies to 4.7GHz (i7 option). The 95×95mm COM Express Type 6 Compact design balances compute performance and space efficiency for embedded and industrial platforms. Memory is provided via two SO‑DIMM slots supporting DDR4‑3200 up to 64GB. Integrated Intel Iris Xe graphics with flexible DDI outputs enable high‑resolution displays for digital signage, medical imaging and vision systems. Expansion includes two PCIe x4 lanes and one PCIe x1 lane; network connectivity uses Intel i211‑AT Gigabit controller. Industrial interfaces, TPM 2.0 and watchdog support secure, reliable deployments. Supported OS: Windows 10 LTSC, Red Hat 8.4, Ubuntu 20.04, Yocto 4.0x. Operating temperature 0–60°C; storage −40–85°C.

Ordering information

• 8.ZRT.80-1645-02-LEF (ECM-C114_V10, i5-1135G7, dual SO‑DIMM, heatsink, LVDS, pack of 20, version V00)
• 8.ZRT.80-1645-03-LEF (ECM-C114_V10, i3-1115G4, dual SO‑DIMM, heatsink, LVDS, pack of 20, version V00)

Technical specifications

• Product type: COM Express Type 6 Compact module
• Size: 95×95mm
• Processors: Intel 11th Gen Tiger Lake‑U i3/i5/i7 (28W)
• Chipset: SoC
• Memory: DDR4‑3200, 2×SO‑DIMM, up to 64GB
• Graphics: Intel Iris Xe
• PCIe: 2×PCIe x4 + 1×PCIe x1
• Displays: 3×DDI (HDMI/DVI/DP configurable) + eDP/LVDS option
• USB: 4×USB3.0; 8×USB2.0
• Serial: 2×SER
• LAN: 1×Gigabit (Intel i211‑AT)
• SATA: 2×SATA3.0
• Audio: HDA
• GPIO: 8‑bit GPIO
• Watchdog: supported
• TPM: TPM 2.0
• Power input: ATX/AT
• Operating temp: 0–60°C
• Storage temp: −40–85°C
• OS: Windows 10 LTSC / Red Hat 8.4 / Ubuntu 20.04 / Yocto 4.0x