Driver module ECM-SKY6H1

telemonitoringUSBEthernet

Product Overview
ECM-SKY6H1 is a COM‑Express Type 6 Basic module based on 6th/7th Gen Intel Core (Skylake‑H / Kaby Lake‑H) and Xeon platforms. It uses the 95×125 mm COMe Type 6 Basic form factor, supports dual‑channel DDR4 SO‑DIMM up to 64 GB and provides flexible PCIe Gen3 expansion including a configurable PCIe x16 lane. The module targets industrial embedded applications such as military communications, industrial automation and vehicle computing.

Product Features

• Supports 6th/7th Gen Intel Core (i7/i3) and Xeon processors
• COM‑Express Type 6 Basic form factor, 95×125 mm
• Dual‑channel DDR4 SO‑DIMM, up to 64 GB (6th gen 2133 MHz; 7th gen 2400 MHz)
• PCIe Gen3 expansion: 1×PCIe x16 (configurable: 1×16 / 2×8 / 1×8 + 2×4) and multiple x1 lanes
• Display: 2×DDI (HDMI/DP configurable) + eDP (default) or VGA + LVDS; supports multi‑display
• I/O: 4×SATA3.0, 4×USB3.0, 4×USB2.0, Intel i219 Gigabit Ethernet, HDA audio, 8‑bit GPIO, LPC and SMBUS
• Wide temperature range: storage −40~85 °C; operating 0~60 °C; supports Windows 10 and Yocto Linux
• Power: ATX/AT dual mode; input 8.5–20 V

Detailed Description
Selectable CPU options include i7‑6820HQ, i7‑7700HQ, i7‑6822EQ, i7‑6820EQ and i3‑6100E. i7 variants offer quad‑core with Hyper‑Threading while i3 variants are dual‑core; turbo frequencies vary by SKU up to 3.8 GHz. Chipset options are QM170 (Core) or CM236 (Xeon). Memory is provided via two SO‑DIMM DDR4 sockets. Expansion includes a full PCIe Gen3 x16 lane and multiple configurable PCIe x1 lanes, allowing GPUs, FPGA or RAID/storage controllers. Two display configuration schemes accommodate industrial display interfaces. Standard storage and peripheral interfaces include SATA3.0, USB3.0/2.0, Intel i219 Ethernet plus embedded control signals and watchdog.

Specification (extracted from product table)
Model: ECM‑SKY6H1
Processor options: i7‑6820HQ / i7‑7700HQ / i7‑6822EQ / i7‑6820EQ / i3‑6100E
Core/Threads: i7 models 4C/8T; i3 model 2C/4T
Max. Speed: 3.6 GHz / 3.8 GHz / 2.8 GHz / 3.5 GHz / 2.7 GHz (per SKU)
L2 Cache: 8M / 6M / 8M / 8M / 3M (per CPU)
TDP: 45W / 45W / 25W / 45W / 35W (per CPU)
Instruction sets: SSE4.1, SSE4.2, AVX2
Chipset: Core → QM170; Xeon → CM236
BIOS: AMI EFI
PCIe x16: PCIe Gen3 (8.0 GT/s), configurable 1×16 / 2×8 / 1×8 + 2×4
PCIe x1: PCIe Gen3, up to 8×PCIe x1 (configurable)
Memory: DDR4, 2×SO‑DIMM, max 64 GB (7th gen 2400 MHz; 6th gen 2133 MHz)
Storage: 4×SATA3.0 (6 Gbps)
Graphics: 2×DDI (HDMI/DP configurable) + 1×eDP (default) or VGA + LVDS option
Ethernet: Intel i219 Gigabit
Connector: COMe 220‑pin
Internal I/O: 4×USB3.0, 4×USB2.0, HDA audio, 8‑bit GPIO, 1×LPC, 1×SMBUS, watchdog, 1×FAN header
Buttons: Power, Reset
Power type: ATX/AT dual; input Vin 8.5–20 V; VSB 4.75–5.25 V; RTC battery 2.0–3.3 V
Power connector: backplane supply
Operating temp: 0~60 °C
Storage temp: −40~85 °C
Operating humidity: 20~90% non‑condensing
Dimensions: 95×125 mm
PCB color: Green
OS: Windows 10 1809; Yocto 2.4 Rocko