Automatic fluid dispenser ASYMTEK Vantage Series

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Overview
The ASYMTEK Vantage® Series is a family of precision dispensing systems designed for advanced semiconductor packaging and high-density electronics assembly. The platform integrates high-speed IntelliJet® jetting, automated calibration, closed-loop process control and Canvas® dispensing software to deliver repeatable, traceable fluid application across wafer-, substrate- and panel-level production.

Key features

• Dispense into die-to-die gaps <200 μm and avoid keep-out zones <250 μm
• Single IntelliJet® throughput up to 49,000 DPH; dual IntelliJet® up to ~90,000 DPH
• Automated calibration and fast, repeatable setup
• Confocal/laser height sensing for reflective and transparent panels
• Patented real-time dispense correction and closed-loop controls for consistency
• Integrated inspection options reduce scrap and rework
• Industry 4.0-ready connectivity via ASYMTEK NE Connect API and Canvas® SDK

System configurations

• Essential – single-valve configuration for small-volume dispensing and tight keep-out areas
• High Yield – adds precision weighing for volume control and improved yield with single valve
• Productivity – dual independent valves for higher throughput and simultaneous two-part dispensing
• Productivity Plus – dual valves plus precision scale and real-time correction for maximum throughput

Software — Canvas®

• Graphical programming: scan workpiece and simulate dispensing on a virtual canvas
• Guided wizards, quick-reference graphs and data tiles
• Offline programming to avoid production downtime
• Data logging and traceability for process control

Supported valves & pumps

• IntelliJet® jetting (single/dual)
• NexJet NJ-8 with ReadiSet cartridge
• DispenseJet series (DJ-2100, DJ-2200, DJ-9500)
• DV series Heli-Flow pumps (DV-7000, DV-8000C)
• Syringe and diaphragm valves (DV-01, DV-05A, DV-07, DV-09)

Options & accessories

• Calibrated Process Jetting (CPJ)
• Continuous Path Motion Control
• Fids-on-the-Fly vision tools and Monocle Vision Package (MVP)
• Confocal/laser height sensors and thermal management for large panels

Applications

• Wafer-level and substrate-level advanced packaging
• Panel-level packaging (Vantage supports up to 310 × 310 mm; Vantage XL up to 510 × 515 mm)
• Underfill, adhesives, flux, solder paste touch-up, TIM and other precision fluid applications

Technical specifications

• Minimum die-to-die gap capability: <200 μm
• Keep-out avoidance: <250 μm
• Throughput: up to 49,000 DPH (single IntelliJet®); up to ~90,000 DPH (dual IntelliJet®)
• Panel handling: standard 310 × 310 mm; XL up to 510 × 515 mm (custom tooling available)
• Height sensing: confocal/laser for reflective/transparent substrates
• Process control: automated calibration, closed-loop control, full traceability, patented real-time correction
• Connectivity: Industry 4.0-ready (ASYMTEK NE Connect API, Canvas® SDK)