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Automated inspection system SQ3000 M2
medicalhigh-speed

Automated inspection system - SQ3000 M2 - Nordson EFD - medical / high-speed
Automated inspection system - SQ3000 M2 - Nordson EFD - medical / high-speed
Automated inspection system - SQ3000 M2 - Nordson EFD - medical / high-speed - image - 2
Automated inspection system - SQ3000 M2 - Nordson EFD - medical / high-speed - image - 3
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Go to the Nordson EFD website for more information

Characteristics

Operational mode
automated
Applications
medical
Other characteristics
high-speed

Description

Overview
The SQ3000M2 is an automated optical inspection (AOI) system designed for wirebond, semiconductor packaging and PCB assembly applications. It provides inline defect detection and optional metrology to help improve yields, streamline processes and reduce costly field returns.

Inspection Capabilities
  • Field-of-View (FOV): 8.2 × 6.8 mm (1X)
  • Resolution: 3.4 µm (1X)
  • Lighting: Proprietary Fusion Lighting™ multiangle LED
  • Imaging: 5-megapixel color camera (2448 × 2048)
  • Optics: High-resolution, low-distortion optics with coaxial illumination
  • Metrology: Optional AFVM / FVM (Focus Variation Measurement) sensor
  • Supported device types: JEDEC, MCMs, Hybrids, FlipChip, BGA, microBGA, MEMS, waffle pack


System Specifications
System dimensions (W × D × H): 110 × 128 × 143 cm — height excludes signal-light pole and levelling feet.
Weight: ≈ 965 kg (2127 lbs.).

Options
  • SPC software
  • Barcode readers (1D/2D)
  • Programming software: ePM-AI
  • Offline Defect Review
  • Certification Target
  • CMM capability
  • AI capability
  • Secondary optics (5X or 10X)
  • Tertiary optics (0.5X)


Imaging & Measurement Features
Fusion Lighting™ multiangle LED optimizes defect contrast across complex topographies. Standard 5 MP color imaging with optional FVM metrology for surface/height measurement enables combined inspection and measurement workflows.

Documentation & Media
Product brochure and demonstration videos are available to illustrate system configuration, operation and sample inspection results.

Technical specifications
  • Model: SQ3000M2
  • Type: Automated Optical Inspection (AOI)
  • FOV: 8.2 × 6.8 mm (1X)
  • Resolution: 3.4 µm (1X)
  • Camera: 5 MP color (2448 × 2048)
  • Lighting: Fusion Lighting™ multiangle LED
  • Optics: High-resolution, low-distortion; coaxial illumination
  • Metrology option: AFVM / FVM
  • Supported devices: JEDEC, MCMs, Hybrids, FlipChip, BGA, microBGA, MEMS, waffle pack
  • Dimensions (W × D × H): 110 × 128 × 143 cm
  • Weight: ≈ 965 kg
  • Options: SPC, 1D/2D barcode readers, ePM-AI, Offline Defect Review, Certification Target, CMM, AI, 0.5X/5X/10X optics

Catalogs

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.
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