Computer-controlled inspection system AMI AW C-SAM®

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Overview
The AMI AW Series C-SAM® automated wafer inspection system provides non-immersion ultrasonic scanning using waterfall transducers and a 500 MHz pulser/receiver. It delivers sensitivity better than 5 micron, detects delamination gaps down to ~200 Å, and automates wafer handling, inspection and sorting with user-defined accept/suspect/reject criteria. The system is designed for wafer-level products (BSI sensors, SOI, MEMS, LEDs, chip-on-wafer and unpolished wafers) and supports bonding methods including direct fusion, anodic, glass frit and epoxy bonding.

Applications / Use Cases

• Direct bond techniques - inspect after initial bonding, after anneal and after thinning to improve yields.
• MEMS devices - inspect cavity seal quality prior to singulation.
• Unpolished / raw wafers - detect natural voids that may cause pinholes during downstream processing.
• LEDs - automated die-by-die bond inspection and sorting of bad or suspect die.

Key Technical Advantages
Proprietary high acoustic frequency lenses and factory-designed ultra-high resolution transducers produce detailed images on materials highly transparent to ultrasound (silicon, sapphire, glass, GaAs). Waterfall transducers enable non-immersion scanning to minimize contamination and false bond indications. AW300 series offers full automation, SECS/GEM compatibility and customer customization options.

Features

• Non-immersion waterfall transducer scanning to reduce contamination risk and false positives.
• Optional dual loadports for increased batch capacity; supports 300 mm FOUP/FOSB, 200 mm SMIF pods and open cassettes 100–200 mm.
• Automated analysis software measuring percent bonded/disbonded area, void sizing and counting, open cavity seals and minimum seal width; automatic accept/suspect/reject based on user criteria.
• 500 MHz bandwidth pulser/receiver and ultra-high resolution transducers for optimum imaging performance.
• Cleanroom configurations available: Class 1000 and Class 100.

Specifications

• Sensitivity: better than 5 micron (application dependent).
• Pulser/Receiver bandwidth: 500 MHz.
• Detectable delamination gap: down to ~200 Å.
• Throughput: approximately 2× faster than competitive systems (depending on configuration).
• Supported carriers: 300 mm FOUP/FOSB, 200 mm SMIF, open cassettes 100–200 mm.
• Automation / Compliance: fully automated inspection; SECS/GEM compatible.