Optical inspection system AMI AW C-SAM® series
fully-automaticmedicalhigh-capacity

Optical inspection system - AMI AW C-SAM® series - Nordson EFD - fully-automatic / medical / high-capacity
Optical inspection system - AMI AW C-SAM® series - Nordson EFD - fully-automatic / medical / high-capacity
Add to favorites
Compare this product

Characteristics

Type
optical
Operational mode
fully-automatic
Applications
medical
Other characteristics
high-speed, in-line, stand-alone, high-capacity

Description

The AW Series offers better than 5 micron sensitivity and throughput approximately two times faster than competitive systems. It features non-immersion scanners that eliminate false positives due to DI water ingression. The AW Series automatically handles, inspects, and sorts wafers based on user-defined accept/reject criteria. It is designed to handle wafer-level products such as BSI sensors, SOI, MEMS, LEDs, Chip-on-Wafer, and Unpolished Wafers, manufactured by various methods including direct fusion, anodic, glass frit, and epoxy bonding. - **Direct bond techniques**: Yields can be significantly improved by inspecting at three production stages—after initial bonding by Van der Waals forces, after annealing, and after thinning. - **MEMS devices**: Cavity seals quality can be examined prior to singulating. - **Raw, unpolished wafers**: Detect natural voids that cause “pinholes” during further processing. - **LEDs**: Examine the bonding of the layers automatically on a die-by-die basis and sort bad and suspect die. The AW Series uses Nordson TEST & INSPECTION's proprietary high acoustic frequency lenses for detailed images. Special lenses are required since materials like Silicon, Sapphire, Glass, and GaAs can be very transparent to ultrasound. Delamination with separation as thin as 200Å can be detected. The AW300 Series delivers fully automated inspection, is SECS/GEM compliant, and can be customized to your requirements. **Features** - Waterfall Transducer for non-immersion scanning minimizes contamination risk and false bond indications. - Dual loadports (optional) for larger batch capacity with loadports for 300mm FOUP or FSOB carriers, 200mm SMIFs, and 100mm to 200mm cassettes. - Automated analysis software accurately determines bond percentage, void size and count, open cavity seals, and minimum seal width, with automatic accept/suspect/reject based on user criteria. - 500 MHz bandwidth pulser/receiver and ultra-high resolution transducers for superior images. - Class 1000 and Class 100 clean room rated options available.

Catalogs

No catalogs are available for this product.

See all of Nordson EFD‘s catalogs

Other Nordson EFD products

Life Sciences

*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.