Computer-controlled inspection system AMI DF2400/FACTS2 C-SAM®

automatedPC-controllablehigh-speed

Overview
FACTS² (AMI DF2400) is an automated in-line C-SAM inspection system engineered for high-volume production. It delivers high throughput with minimal operator interaction by inspecting two trays or modules simultaneously and using multiple scan heads with linear-motor drives and inertial balancing to minimize vibration and sample motion.

Key capabilities
The system supports JEDEC trays and Auer Boat carriers as part of an in-line process. It also handles lead-frame strips, IGBT power modules, MLCCs, flip chips and similar packaged components. Non-immersion scanning with the Nordson WaterFall transducer reduces contamination and fluid ingress risk while enabling fast image acquisition. Polygate and Time Domain Imaging capture multiple depths for comprehensive internal-packaging defect analysis.

Features

• Automated in-line inspection with simultaneous two-tray/module scanning for high throughput
• Precision imaging with scanner accuracy around ±0.5 µm
• Multiple scan-head configurations to increase throughput (2×–7× vs prior tools depending on setup)
• Non-immersion WaterFall transducer to minimize contamination, fluid ingress and part movement
• Automated Data Analysis Package for pre-defined accept/reject criteria and automatic flagging
• Optional Vacuum Hold Down to stabilise small parts during scans
• Separate drying chamber with up to four oscillating air knives and optional heat for rapid drying
• Factory integration via SECS-II / GEM (SEMI E30) and SMEMA

Additional features built into the FACTS² / DF2400

• Sonolytics software platform (Sonolytics for Windows 7 support)
• Auto Data Analysis Package and defect classification tools
• 2-scanner configurations with Region of Interest (ROI) scanning
• Polygate support for up to 100 depths of interest
• Time Domain Imaging and Auto Scan for multiple locations
• Precision focusing for narrow layer extraction

Applications

• In-line inspection of packaged electronic components in JEDEC trays and Auer Boats
• Inspection of lead-frames, IGBT power modules, MLCCs, flip chips and similar components
• Detection and classification of internal packaging defects: voids, disbonds, delaminations and cracks

Software & data
Equipped with Sonolytics and a SECS-II / GEM (SEMI E30) interface for electronic data tracking. Batch and lot data are available as images or tabulated analysis files (spreadsheets and tray maps). Accept/reject criteria and defect categorization can be configured to match customer quality standards.

caractéristiques / spécifications techniques

• Model: AMI DF2400 (FACTS²)
• Inspection mode: Non-immersion C-SAM scanning using WaterFall transducer
• Scan precision: approximately ±0.5 µm
• Throughput: simultaneous inspection of two trays/modules; throughput improvement 2×–7× vs prior tools (configuration dependent)
• Scan heads: multiple scan heads; 2-scanner option with ROI scanning
• Depth capability: Polygate up to 100 depths; Time Domain Imaging
• Hold down: Optional vacuum hold down for small parts
• Drying: Separate drying chamber with up to four oscillating air knives and optional heat
• Carrier support: JEDEC trays and Auer Boat carriers (configurable)
• Software: Sonolytics (Windows 7 supported), Auto Data Analysis Package
• Interfaces: SECS-II / GEM (SEMI E30), SMEMA
• Automation: Auto Scan for multiple locations; automated accept/reject analysis and defect categorization
• Typical target parts: lead-frame strips, IGBT power modules, MLCCs, flip chips and other packaged components