Electronic inspection system SE3000-DD™

medical

Metrology Grade Accuracy at Production SpeedThe SE3000 DD SPI system offers unmatched accuracy with the revolutionary MRS® technology by meticulously identifying and rejecting reflections caused by shiny components and reflective solder joints. Effective suppression of multiple reflections is critical, making MRS an ideal technology solution for a wide range of applications including those with very high quality requirements.CyberOptics has advanced the proprietary Multi-Reflection Suppression (MRS) sensor to an even finer resolution. The Ultra-High Resolution MRS sensor enhances the SE3000 DD platform, delivering superior inspection performance, ideally suited for the 0201 metric process and micro-electronic applications where an even greater degree of accuracy and inspection reliability is critical.Flexibility at Its BestThe SE3000 DD 3D Solder Paste Inspection (SPI) System is an extension of the award-winning SE3000™ 3D SPI platform. The dual lane, dual sensor system maximizes flexibility catering to varying PCB widths. This unique design provides the ability to inspect high volume assemblies, the convenience of inspecting different assemblies and board sizes simultaneously on different lanes, or even switching from dual lane to single lane mode to inspect very large boards.Not only does the SE3000 DD provide PCB flexibility, it also provides the flexibility to choose two of the same or two different proprietary MRS sensors.Fast, Smart, Easy-to-use softwareThe SPI V5 series software delivers world-class user experience with its intuitive interface, completely changing the way users interact with our system. With full multi-touch experience, SPI V5 series software offers a range of revolutionary features that enable smarter and faster inspection.Flexibility at Its Best for Increased ThroughputWith a smaller footprint than 2 SE3000 standard systems, the dual lane, dual sensor SE3000-DD features a smart conveyor design solution providing maximum flexibility to cater to varying PCB widths. This unique design gives you the convenience of inspecting different board sizes on different lanes or even switching from dual lane to single lane mode to inspect very large boards. With SE3000-DD, you can also quickly inspect different programs on different lanes as well as perform synchronous or asynchronous inspection.Inspection SpeedStandard MRS Sensor: 35 cm²/sec (2D+3D)Ultra-High Resolution MRS Sensor: 15 cm²/sec (2D+3D)PCB Size (Max.)SE3000 DD: Single Lane: 510 x 510 mm (20 x 20 in.); Dual Lane: 350 x 320 mm (13.7 x 12.5 in.)SE3000 D: Single Lane: 510 x 510 mm (20 x 20 in.); Dual Lane: 510 x 320 mm (20 x 12.5 in.)Field of View (FOV)Standard MRS Sensor: 36 x 36 mmUltra-High Resolution MRS Sensor: 21 x 21 mmResolutionStandard MRS Sensor: 18µmUltra-High Resolution MRS Sensor: 9µmMinimum Component SizeStandard MRS Sensor:0402 mm (01005 in.)Ultra-High Resolution MRS Sensor:0201 mm (008004 in.)Component Height ClearanceTop: 50 mm (1.96 in.); Bottom: 30mm (1.18 in.)Metrology Grade Accuracy at Production SpeedAdvanced Multi-Reflection Suppression (MRS®) sensor technologyUltra-High Resolution MRS sensor for micro-electronic applicationsDual lane, dual sensor system for maximum flexibilityAbility to inspect different assemblies and board sizes simultaneouslySwitchable from dual lane to single lane for large boardsChoice of two same or different proprietary MRS sensorsIntuitive SPI V5 series software with multi-touch experienceInspection Speed: Standard MRS Sensor: 35 cm²/sec (2D+3D); Ultra-High Resolution MRS Sensor: 15 cm²/sec (2D+3D)PCB Size (Max.): SE3000 DD: Single Lane: 510 x 510 mm; Dual Lane: 350 x 320 mm; SE3000 D: Single Lane: 510 x 510 mm; Dual Lane: 510 x 320 mmField of View (FOV): Standard MRS Sensor: 36 x 36 mm; Ultra-High Resolution MRS Sensor: 21 x 21 mmResolution: Standard MRS Sensor: 18µm; Ultra-High Resolution MRS Sensor: 9µmMinimum Component Size: Standard MRS Sensor: 0402 mm (01005 in.); Ultra-High Resolution MRS Sensor: 0201 mm (008004 in.)Component Height Clearance: Top: 50 mm (1.96 in.); Bottom: 30mm (1.18 in.)