OverviewThe ASYMTEK Spectrum® II S2-900 is a precision fluid dispensing system engineered for consistent, high-volume dispensing in assembly of mobile electronics, semiconductors, MEMS and PCBs. Configurable system packages align throughput, yield and application requirements.
Key benefits- Compact, space-saving footprint for production floors
- Fast, precise narrow-gap dispensing
- Increased throughput with dual‑simultaneous dispensing and dual‑lane options
- Patented closed-loop process controls for repeatability
- Scalable support for multiple valve types and applications
- Fluidmove® software with advanced process routines
- High X–Y wet-dispense accuracy and precision Z-axis control
Choose a system package- Essential – Single-lane, heated processing for flexible precision dispensing in high-mix production.
- High Yield – Adds high-resolution Monocle vision and piezo IntelliJet® jetting for tighter control and accuracy.
- Productivity – Dual-lane configuration to raise throughput by allowing dispensing on one lane while the other queues.
- Productivity Plus – Dual-lane with pre/post-queue heating stations to reduce conveyance time and maximize throughput.
Supported equipment and software- Multiple valve types: jetting, auger, time‑pressure, syringe, diaphragm, needle and metering valves
- Applications: underfill, cavity fill, die‑attach, precision coating, encapsulation, adhesive and sealant dispensing
- Dual‑lane dispensing and lane-specific heating options
- Fluidmove®: fiducial finding, Iterative Dummy Dot, Tilt Dispensing, Auto Dual Simultaneous (ADS), Monocle Vision Package (MVP) and more
Supported valves / representative dispense modules- IntelliJet® jetting system
- NexJet NJ‑8 jetting (ReadiSet cartridges)
- DispenseJet series (DJ‑2100, DJ‑2200, DJ‑9500)
- DV‑7000 / DV‑8000C Heli‑Flow pumps
- Syringe, needle and adjustable metering valves; diaphragm valves with suckback
Supported options and capabilities- Calibrated Process Jetting (CPJ)
- High‑resolution Monocle Vision Package (MVP)
- Non‑contact laser height sensor
- Fids‑on‑the‑Fly and other vision‑guided routines
- Continuous path motion control and Tilt Dispensing
- Dual‑simultaneous and dual‑action dispensing modes
Applications / Typical uses- Precision underfill for PCBA and semiconductor packaging
- Cavity filling and encapsulation
- Selective and conformal coating
- Solder mask, adhesive and sealant dispensing
- Micro‑dispensing for MEMS and high‑density electronics
Technical specifications- Model family: ASYMTEK Spectrum II S2‑900 platform
- Motion control: high‑accuracy X–Y table with precision Z‑axis
- Dispense modes: jetting, time‑pressure, volumetric, syringe/needle, metering valves
- Throughput: single‑lane, dual‑lane, Productivity and Productivity Plus configurations with pre/post heating
- Process control: patented closed‑loop controls for repeatability
- Vision options: Monocle MVP and high‑resolution cameras
- Software: Fluidmove® with advanced dispensing features
- Materials: supports underfill, encapsulants, coatings, adhesives and production fluids
- Integration: designed for production‑floor integration and modular automation