Optical inspection system SQ7000™+

computer-controlledautomatedwith touchscreen

Overview
SQ7000™+ Multi-Function System featuring Multi-Reflection Suppression® (MRS®) sensor technology delivers high-resolution 3D imaging, high-speed inspection and metrology in a single inline platform capable of AOI, SPI and in-line CMM operations. The system integrates a 5 µm MRS sensor and fusion algorithms to reduce reflection artifacts and provide metrology-grade measurements at production speed.

Key Capabilities

• 5 µm MRS sensor for suppression of multiple reflections and improved measurement accuracy
• Combined inspection modes: 3D AOI (Automated Optical Inspection), SPI (Solder Paste Inspection) and inline CMM (Coordinate Measurement)
• High-speed inspection and metrology (example speed: 16 cm²/sec for combined 2D+3D)
• Intuitive multi-touch software with 3D visualization tools
• Advanced programming tools: AutoTeach, AutoTune, AutoDefine to accelerate setup
• AI² (Autonomous Image Interpretation) for automated model building and robust defect discrimination

Software and Measurement Suites

• SQ7000+ AOI software: graphical user interface, multi-touch controls, rapid programming and tuning
• NordsonCMM™: coordinate measurement suite delivering metrology-grade measurements (coplanarity, distances, heights, datum X/Y, regression fitting, radius, max/min/avg/sigma, etc.)
• AI² for automated defect detection, model updates and reduced manual parameter tuning

Applications

• Advanced packaging and semiconductor inspection
• Micro/mini LED inspection
• High-density SMT inspection including 008004 / 0201 SPI
• Socket metrology and other high-end CMM inline tasks requiring production speed and metrology accuracy

Additional Notes
System supports extensive component and defect coverage including standard SMT (chips, J-lead, gull-wing, BGA), through-hole, odd-form parts, connectors and pins. MRS sensor and fusion algorithms reduce reflection-based distortions for precise measurement on shiny components and surfaces.

Technical specifications

• Inspection Speed: 16 cm²/sec (2D+3D)
• PCB Size (min/max): Minimum 50 x 50 mm; Maximum 420 x 320 mm
• Resolution (XY / Z): 5 µm / 0.1 µm
• Maximum Weight (PCB or Sample): 10 kg
• Minimum Component Size: 0201 (008004 in.)
• Component Height Clearance: Top: 20 mm; Bottom: 50 mm
• Field of View (FOV): 25 x 25 mm
• Min./Max. Feature Height: Min. 10 µm; Max. 400 µm at spec (2.4 mm capability)
• Component Types Inspected: SMT (chips, J-lead, gull-wing, BGA), through-hole, odd-form, clips, connectors, header pins
• Typical Defects Detected: missing components, polarity, tombstone, flipped, wrong part, body/lead damage, gold finger contamination, excess/insufficient solder, bridging, through-hole pin issues
• Coordinate Measurement Capability: line/distance/X,Y/mid line/inter point/regression shifted/datum X,Y/LSF X,Y offset/height/local height/regression/radius/coplanarity/distance to plane/2nd order fitting/difference/absolute/max/min/avg/sigma