Product DetailsThe SQ7000™+ is a multi-function system designed for 3D Automated Optical Inspection (AOI), Solder Paste Inspection (SPI), and Coordinate Measuring Machine (CMM) applications. This advanced inspection platform is engineered to deliver high-speed, high-accuracy inspection and measurement for electronics manufacturing, ensuring superior quality control and process optimization.Multi-Function Capability: Supports 3D AOI, SPI, and CMM in a single platform, reducing equipment footprint and increasing flexibility on the production line.High-Speed, High-Accuracy: Utilizes advanced imaging and processing technologies to provide fast and precise inspection results, minimizing false calls and maximizing throughput.Advanced 3D Imaging: Equipped with state-of-the-art 3D sensors and lighting systems for accurate defect detection and measurement of complex assemblies.Flexible Integration: Easily integrates into existing SMT lines and supports a wide range of PCB sizes and component types.Comprehensive Software Suite: Includes powerful analysis and reporting tools for real-time process monitoring, traceability, and data-driven decision making.Industry Applications: Ideal for electronics manufacturing, automotive, aerospace, medical devices, and other industries requiring stringent quality standards.Key Features:3D AOI, SPI, and CMM functionality in one systemHigh-speed inspection with advanced algorithmsAccurate 3D measurement and defect detectionFlexible PCB handling and support for various board sizesComprehensive data analysis and reporting toolsEasy integration with MES and factory automation systemsTechnical Specifications:Inspection Modes: 3D AOI, SPI, CMMImaging Technology: Advanced 3D sensors and multi-angle lightingSupported PCB Sizes: Wide range (details available upon request)Software: Full-featured analysis, SPC, and traceability suiteIntegration: Compatible with standard SMT line protocolsApplications: Electronics, automotive, aerospace, medical, industrial