Plasma surface treatment system MARCH SPHERE™

automated

Overview
The SPHERE Series delivers advanced plasma surface treatment designed to maximize uniformity, repeatability, and throughput across wafer-level (WLP) and panel-level (PLP) packaging applications. Built around a patented three-axis symmetrical plasma chamber, SPHERE systems ensure consistent treatment across every substrate while maintaining tight process control for reliable, repeatable production. The platform emphasizes process precision, short cycle times, and production-ready automation to improve yield, reduce variability, and enhance downstream adhesion and reliability.

MARCH ExoSPHERE
Superior plasma treatment for panel-level packaging. The ExoSPHERE system is engineered for high-throughput plasma treatment for panel-level applications. Its symmetrical chamber architecture delivers uniform activation and cleaning across large surfaces, enabling improved adhesion and void-free underfill results. The system accommodates diverse product formats and integrates easily into automated or standalone production environments. SMARTTune™ plasma management ensures fast setup and stable operation, minimizing downtime while maintaining process consistency.

• Ideal for: Panel-level processing; Underfill preparation; Surface activation and adhesion improvement; Contamination removal

MARCH StratoSPHERE
Superior plasma treatment for wafer-level packaging. The StratoSPHERE platform is optimized for wafer-level applications and supports wafers up to 300 mm (12 inches). Its plasma confinement and chamber symmetry deliver high uniformity and repeatability. Designed for high throughput, the system features modular configurations, advanced wafer handling, and rapid changeover capability — enabling efficient operation across diverse wafer processes.

• Ideal for: Wafer-level cleaning and contamination removal; Photoresist descum and stripping; Surface preparation and adhesion enhancement; Dielectric patterning

Key features and capabilities

• Patented three-axis symmetrical plasma chamber for exceptional treatment uniformity and repeatability
• Designed for both wafer-level and panel-level packaging workflows
• SMARTTune™ plasma management for fast setup and stable, repeatable operation
• Production-ready automation and modular configurations to support throughput and quick changeovers
• Supports diverse product formats including wafers, panels, carriers, strips, and JEDEC/Auer® boats
• Optimized for improving adhesion, enabling void-free underfill, contamination removal, and surface activation

Technical characteristics / specifications

• Platform family: MARCH SPHERE™ Series (includes ExoSPHERE for panels and StratoSPHERE for wafers)
• Chamber architecture: Three-axis symmetrical plasma chamber (patented)
• Control: SMARTTune™ plasma management
• Throughput: Engineered for high uniformity, repeatability, and short cycle times (high-throughput capable)
• Supported wafer size: up to 300 mm (12 inches) for wafer-level configuration
• Supported formats: panels, wafers, carriers, strips, JEDEC/Auer® boats
• Primary applications: panel-level processing, underfill preparation, surface activation/adhesion improvement, contamination removal, wafer-level cleaning, photoresist descum/stripping, dielectric patterning
• Integration: Designed for integration into automated production lines or standalone operation