OverviewPoint-of-use (POU) thermoelectric process thermostat designed for precise temperature control in semiconductor and cleanroom processes. Reduces energy consumption compared with compressor-based systems and can be installed underfloor at the point of use to minimize cleanroom footprint. Controls process temperature profiles to ±0.1 °C for improved wafer-to-wafer homogeneity.
Features- Thermoelectric process thermostat with low energy consumption
- Quiet, low-vibration operation using refrigerant-free cooling technology
- No filters or DI components required
- Connection for CDA (clean dry air) purge to prevent condensation
- Use of perfluorinated heat transfer fluids
- Available in water-cooled configuration
- Compact dimensions and low weight for point-of-use installation
- Extremely low internal volume of heat transfer liquid
- Compliant with SEMI S2 and F47 standards
Working range- Minimum working temperature: −20 °C
- Maximum working temperature: 90 °C
- Temperature stability: ±0.1 K
Cooling capacity (examples)Temperature — Cooling capacity 50 Hz — Cooling capacity 60 Hz
20 °C — 1.2 kW — 1.2 kW
10 °C — 0.9 kW — 0.9 kW
0 °C — 0.6 kW — 0.6 kW
−10 °C — 0.35 kW — 0.35 kW
−20 °C — 0.08 kW — 0.08 kW
Technical data (according to DIN 12876)- Working temperature range: −20 ... 90 °C
- Temperature stability: ±0.1 K
- Minimum heater power: 3 kW
- Minimum filling volume: 1 L
- Maximum filling volume: 1.3 L
- Dimensions (WxDxH): 116 x 232 x 470 mm
- Weight: 15 kg
- Power supply: connection to PSC