Product descriptionPoint-of-use (POU) temperature control system designed for precise process temperature management in semiconductor and laboratory environments. POU operation reduces energy consumption by up to 90% versus compressor-based chillers and allows compact installation close to the process, including underfloor mounting to minimize cleanroom footprint. Quick, stable control to ±0.1 °C improves wafer-to-wafer homogeneity and process repeatability.
Features- Thermoelectric process thermostat with low energy consumption
- Quiet, low-vibration operation using refrigerant-free cooling technology
- No filters or DI components required for the cooling circuit
- Purge connection for clean dry air (CDA) to prevent condensation
- Designed for use with perfluorinated heat transfer fluids
- Water-cooled system for stable thermal performance
- Compact footprint and low system weight
- Extremely low internal volume of heat transfer liquid
- Compliant with SEMI S2 and F47 standards
Working range- Minimum working temperature: -20 °C
- Maximum working temperature: 90 °C
- Temperature stability: ±0.1 K
Cooling capacity (table)Temperature | Cooling capacity 50 Hz | Cooling capacity 60 Hz
20 °C | 2.45 kW | 2.45 kW
10 °C | 1.93 kW | 1.93 kW
0 °C | 1.4 kW | 1.4 kW
-10 °C | 0.88 kW | 0.88 kW
-20 °C | 0.35 kW | 0.35 kW
Accessories (examples)Technical specifications- Working temperature range: -20 ... 90 °C
- Temperature stability: ±0.1 K
- Heater power min.: 6 kW
- Min. filling volume: 1.25 L
- Max. filling volume: 1.6 L
- Dimensions (WxDxH): 116 x 300 x 560 mm
- Weight: 27 kg
- Net weight: 26.81 kg
- Power supply: Connection to PSC